hotwav T7 Pro vs Meizu mblu 21

In sintesi

Marca: Hotwav; Meizu
Data di uscita: giugno 2024, 1 anni e 11 mesi fa; novembre 2024, 1 anni e 6 mesi fa
AnTuTu: 241.300 Antutu v10 Overall performance better than 58% of devices; 239.300 Antutu v10 Overall performance better than 57% of devices

Dimensione: 6.6"; 6.79"
Risoluzione: 1080 x 2460 px FHD+; 720 x 1640 px HD+
Tipo: LCD IPS; LCD IPS
Densità: 407 ppi Very high density; 264 ppi Medium Density
Rapporto d’aspetto: 21:9; 20:9
Caratteristiche: Without Notch, Brightnes 480 cd/m² (typ), Scratch resistant, Corning Gorilla Glass 3, Capacitive, Multi-touch; Hole-punch Notch, Refresh rate 90 Hz, 2.5D curved glass screen, Capacitive, Multi-touch, Frameless

Chipset: MediaTek MT8788V; Unisoc Tiger T606
CPU: 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz; 2x1.6 GHz Cortex A75 + 6x1.6 GHz Cortex A55
Tipo di CPU: Octa-Core; Octa-Core
Processo: 12 nm; 12 nm
Frequenza: 2 GHz; 1.6 GHz
GPU: Mali-G72 MP3; ARM Mali-G57
RAM: 6 GB; 4 GB
Tipo di RAM: LPDDR4X RAM; —
64 bit: Yes; Yes

Risoluzione: 64 Mpx; 13 Mpx
Apertura: Unknow; Unknow
Flash: LED; LED
Stabilizzazione ottica: No; No
Slow motion: No, 30 fps; No, 30 fps
Caratteristiche: Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Dual camera, Digital image stabilization, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Dimensione pixel: —; 0.80 µm

Dimensioni: 82.8 mm 174.6 mm 12.8 mm Print 3D Model; 78.0 mm 170.8 mm 9.4 mm Print 3D Model
Peso: 292 g; 196 g
Materiali: Rugged Smartphone, Plastic , Faux leather; Plastic
Colori: Black Orange; Black White Blue
Resistenza ad acqua/polvere: IP68, IP69 , MIL-STD-810H; —
Resistenza alle cadute: Class A B C D E 270 drops without defects; —
Riparabilità: Class A B C D E; —
Superficie utile: 71 %; 82 %

Sistema operativo: Android 13 Tiramisu Android 13; Android 14 Upside-down cake Android 14
Servizi Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.0 LELow energy consumption; Bluetooth 5.0 LELow energy consumption
Profili Bluetooth: A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy); A2DP (Advanced Audio Distribution Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Funzioni Wi-Fi: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; —
Funzioni USB: Charging, OTG; Charging, OTG
Navigazione: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B3 (1800), B5 (850), B7 (2600), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800); B1 (2100), B5 (850)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850)