hotwav Cyber 13 Pro vs philips S6310

In sintesi

Marca: Hotwav; Philips
Data di uscita: ottobre 2023, 2 anni e 8 mesi fa; novembre 2024, 1 anni e 7 mesi fa
AnTuTu: 285.000 Antutu v9 Overall performance better than 61% of devices; 237.000 Antutu v10 Overall performance better than 57% of devices

Dimensione: 6.6"; 6.56"
Risoluzione: 1080 x 2408 px FHD+; 720 x 1612 px HD+
Tipo: LCD IPS; LCD IPS
Densità: 396 ppi High Density; 269 ppi Medium Density
Rapporto d’aspetto: 21:9; 20:9
Caratteristiche: Hole-punch Notch, Refresh rate 90 Hz, 1500:1 contrast ratio, Corning Gorilla Glass, Capacitive, Multi-touch; Hole-punch Notch, Refresh rate 90 Hz, Capacitive, Multi-touch, Frameless

Chipset: Unisoc Tiger T619; Unisoc Tiger T606
CPU: 2 x ARM Cortex A75 2.2Ghz + 6 x ARM Cortex A55 1.8Ghz; 2x1.6 GHz Cortex A75 + 6x1.6 GHz Cortex A55
Tipo di CPU: Octa-Core; Octa-Core
Processo: 12 nm; 12 nm
Frequenza: 2 GHz; 1.6 GHz
GPU: GPU ARM Mali-G57; ARM Mali-G57
RAM: 12 GB; 4 GB
Tipo di RAM: LPDDR4X RAM; —
64 bit: Yes; Yes

Risoluzione: 64 Mpx; 50 Mpx
Apertura: Unknow; Unknow
Flash: Dual LED; LED
Stabilizzazione ottica: No; No
Slow motion: No, 30 fps; No, 30 fps
Caratteristiche: Digital zoom, Triple camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Triple camera, Autofocus, Touch focus, Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Capacità: 256 GB; 128 GB
Slot SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Tipo: —; eMMC 5.1 Storage

Dimensioni: 84.2 mm 176.8 mm 16.8 mm Print 3D Model; 76.0 mm 163.5 mm 8.5 mm Print 3D Model
Peso: 380 g; 200 g
Materiali: TPU , Rugged Smartphone; Plastic
Colori: Black; Black
Resistenza ad acqua/polvere: IP68, MIL-STD-810G , IP69; —
Resistenza alle cadute: Class A B C D E 270 drops without defects; —
Riparabilità: Class A B C D E; —
Superficie utile: 70 %; 83 %

Sistema operativo: Android 13 Tiramisu Android 13; Android 14 Upside-down cake Android 14
Servizi Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.3; Bluetooth 4.2
Profili Bluetooth: A2DP (Advanced Audio Distribution Profile); A2DP (Advanced Audio Distribution Profile)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Funzioni Wi-Fi: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Funzioni USB: Charging, OTG; Charging, OTG
Navigazione: GPS, A-GPS, GLONASS, Beidou; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B3 (1800), B7 (2600), B8 (900), B20 (800), B28a (700), B40 (TDD 2300)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B3 (1800), B8 (900)