hotwav Cyber 13 Pro vs hotwav T7S

In sintesi

Marca: Hotwav; Hotwav
Data di uscita: ottobre 2023, 2 anni e 7 mesi fa; gennaio 2025, 1 anni e 4 mesi fa
AnTuTu: 285.000 Antutu v9 Overall performance better than 61% of devices; 241.300 Antutu v10 Overall performance better than 58% of devices

Dimensione: 6.6"; 6.52"
Risoluzione: 1080 x 2408 px FHD+; 1080 x 2460 px FHD+
Tipo: LCD IPS; LCD IPS
Densità: 396 ppi High Density; 407 ppi Very high density
Rapporto d’aspetto: 21:9; 21:9
Caratteristiche: Hole-punch Notch, Refresh rate 90 Hz, 1500:1 contrast ratio, Corning Gorilla Glass, Capacitive, Multi-touch; Water Drop Notch, Brightnes 480 cd/m² (typ), Scratch resistant, Corning Gorilla Glass 3, Dragontrail glass, Capacitive, Multi-touch

Chipset: Unisoc Tiger T619; MediaTek MT8788V
CPU: 2 x ARM Cortex A75 2.2Ghz + 6 x ARM Cortex A55 1.8Ghz; 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz
Tipo di CPU: Octa-Core; Octa-Core
Processo: 12 nm; 12 nm
Frequenza: 2 GHz; 2 GHz
GPU: GPU ARM Mali-G57; Mali-G72 MP3
RAM: 12 GB; 4 GB
Tipo di RAM: LPDDR4X RAM; LPDDR4X RAM
64 bit: Yes; Yes

Risoluzione: 64 Mpx; 21 Mpx
Apertura: Unknow; Unknow
Flash: Dual LED; LED
Stabilizzazione ottica: No; No
Slow motion: No, 30 fps; No, 30 fps
Caratteristiche: Digital zoom, Triple camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Sensore: —; Sony Exmor

Capacità: 256 GB; 128 GB
Slot SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Tipo: —; eMMC 5.1 Storage

Dimensioni: 84.2 mm 176.8 mm 16.8 mm Print 3D Model; 82.8 mm 174.6 mm 12.8 mm Print 3D Model
Peso: 380 g; 310 g
Materiali: TPU , Rugged Smartphone; Rugged Smartphone, Plastic , Faux leather
Colori: Black; Black Green
Resistenza ad acqua/polvere: IP68, MIL-STD-810G , IP69; IP68, IP69 , MIL-STD-810H
Resistenza alle cadute: Class A B C D E 270 drops without defects; Class A B C D E 270 drops without defects
Riparabilità: Class A B C D E; Class A B C D E
Superficie utile: 70 %; 71 %

Sistema operativo: Android 13 Tiramisu Android 13; Android 13 Tiramisu Android 13
Servizi Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.3; Bluetooth 5.0 LELow energy consumption
Profili Bluetooth: A2DP (Advanced Audio Distribution Profile); A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Funzioni Wi-Fi: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Funzioni USB: Charging, OTG; Charging, OTG
Navigazione: GPS, A-GPS, GLONASS, Beidou; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)