hisense E60 Lite vs hotwav T7 Pro

In sintesi

Marca: HiSense; Hotwav
Data di uscita: aprile 2022, 4 anni e 2 mesi fa; giugno 2024, 2 anni fa
AnTuTu: 121.300 Antutu v9 Overall performance better than 52% of devices; 241.300 Antutu v10 Overall performance better than 58% of devices

Dimensione: 6.52"; 6.6"
Risoluzione: 720 x 1600 px HD+; 1080 x 2460 px FHD+
Tipo: LCD IPS; LCD IPS
Densità: 269 ppi Medium Density; 407 ppi Very high density
Rapporto d’aspetto: 21:9; 21:9
Caratteristiche: Water Drop Notch, Capacitive, Multi-touch, Frameless; Without Notch, Brightnes 480 cd/m² (typ), Scratch resistant, Corning Gorilla Glass 3, Capacitive, Multi-touch

Chipset: Spreadtrum Unisoc SC9863A; MediaTek MT8788V
CPU: 4x Cortex A55 1.6 GHz + 4x Cortex A55 1.2 GHz; 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz
Tipo di CPU: Octa-Core; Octa-Core
Processo: 28 nm; 12 nm
Frequenza: 1.6 GHz; 2 GHz
GPU: PowerVR GE8322; Mali-G72 MP3
RAM: 2 GB; 6 GB
64 bit: Yes; Yes
Tipo di RAM: —; LPDDR4X RAM

Risoluzione: 13 Mpx; 64 Mpx
Apertura: Unknow; Unknow
Flash: Dual LED; LED
Stabilizzazione ottica: No; No
Slow motion: No, 30 fps; No, 30 fps
Caratteristiche: Digital zoom, Triple camera, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Capacità: 64 GB; 256 GB
Slot SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Tipo: —; eMMC 5.1 Storage

Dimensioni: 76.7 mm 166.0 mm 9.7 mm Print 3D Model; 82.8 mm 174.6 mm 12.8 mm Print 3D Model
Peso: 199 g; 292 g
Materiali: Plastic; Rugged Smartphone, Plastic , Faux leather
Colori: Blue Gray; Black Orange
Superficie utile: 80 %; 71 %
Resistenza ad acqua/polvere: —; IP68, IP69 , MIL-STD-810H
Resistenza alle cadute: —; Class A B C D E 270 drops without defects
Riparabilità: —; Class A B C D E

Sistema operativo: Android 11 Red Velvet Cake Android 11 Go edition; Android 13 Tiramisu Android 13
Servizi Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 4.2; Bluetooth 5.0 LELow energy consumption
Profili Bluetooth: A2DP (Advanced Audio Distribution Profile); A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy)
Wi-Fi: 802.11b , 802.11g , 802.11n , 802.11n 5GHz; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Funzioni Wi-Fi: Dual band, Wi-Fi Hotspot; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Funzioni USB: Charging, OTG; Charging, OTG
Navigazione: GPS, A-GPS; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B12 (700), B26 (850), B28b (700), B28a (700); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)