hisense E60 Lite vs hotwav Cyber 15

In sintesi

Marca: HiSense; Hotwav
Data di uscita: aprile 2022, 4 anni e 2 mesi fa; maggio 2024, 2 anni e 1 mesi fa
AnTuTu: 121.300 Antutu v9 Overall performance better than 52% of devices; 415.300 Antutu v10 Overall performance better than 68% of devices

Dimensione: 6.52"; 6.6"
Risoluzione: 720 x 1600 px HD+; 1080 x 2408 px FHD+
Tipo: LCD IPS; LCD IPS
Densità: 269 ppi Medium Density; 396 ppi High Density
Rapporto d’aspetto: 21:9; 21:9
Caratteristiche: Water Drop Notch, Capacitive, Multi-touch, Frameless; Hole-punch Notch, Refresh rate 90 Hz, 1500:1 contrast ratio, Corning Gorilla Glass, Capacitive, Multi-touch

Chipset: Spreadtrum Unisoc SC9863A; MediaTek Helio G99 (MT6789)
CPU: 4x Cortex A55 1.6 GHz + 4x Cortex A55 1.2 GHz; 2x Cortex A76 2.2 GHz + 6x Cortex A55 2.0 GHz
Tipo di CPU: Octa-Core; Octa-Core
Processo: 28 nm; 6 nm
Frequenza: 1.6 GHz; 2.2 GHz
GPU: PowerVR GE8322; Mali-G57 MC2
RAM: 2 GB; 12 GB
64 bit: Yes; Yes
Tipo di RAM: —; LPDDR4X RAM

Risoluzione: 13 Mpx; 200 Mpx
Apertura: Unknow; ƒ/ 1.8
Flash: Dual LED; Dual LED
Stabilizzazione ottica: No; No
Slow motion: No, 30 fps; No, 30 fps
Caratteristiche: Digital zoom, Triple camera, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Dual camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Sensore: —; Samsung S5KHP3SP
Dimensione sensore: —; 1/1.4"

Capacità: 64 GB; 256 GB
Slot SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card

Dimensioni: 76.7 mm 166.0 mm 9.7 mm Print 3D Model; 82.3 mm 174.6 mm 12.8 mm Print 3D Model
Peso: 199 g; 290 g
Materiali: Plastic; TPU , Rugged Smartphone
Colori: Blue Gray; Black
Superficie utile: 80 %; 67 %
Resistenza ad acqua/polvere: —; IP68, MIL-STD-810G , IP69
Resistenza alle cadute: —; Class A B C D E 270 drops without defects
Riparabilità: —; Class A B C D E

Sistema operativo: Android 11 Red Velvet Cake Android 11 Go edition; Android 13 Tiramisu Android 13
Servizi Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 4.2; Bluetooth 5.1
Profili Bluetooth: A2DP (Advanced Audio Distribution Profile); A2DP (Advanced Audio Distribution Profile)
Wi-Fi: 802.11b , 802.11g , 802.11n , 802.11n 5GHz; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Funzioni Wi-Fi: Dual band, Wi-Fi Hotspot; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Funzioni USB: Charging, OTG; Charging, OTG
Navigazione: GPS, A-GPS; GPS, A-GPS, GLONASS, Beidou

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B12 (700), B26 (850), B28b (700), B28a (700); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B30 (2300), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100), B71 (600)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)