hisense A9 Pro vs Xiaomi Redmi 13X

In sintesi

Marca: HiSense; Xiaomi
Data di uscita: marzo 2023, 3 anni e 3 mesi fa; marzo 2025, 1 anni e 3 mesi fa
AnTuTu: 102.000 Antutu v9 Overall performance better than 51% of devices; 269.266 Antutu v10 Overall performance better than 60% of devices

Dimensione: 6.1"; 6.79"
Risoluzione: 824 x 1648 px FHD; 1080 x 2460 px FHD+
Tipo: eInk E INK Carta 1200; LTPS LCD
Densità: 302 ppi High Density; 388 ppi High Density
Rapporto d’aspetto: 18:9; 19.5:9
Caratteristiche: Water Drop Notch, Capacitive, Multi-touch, Frameless; Hole-punch Notch, SGS Certified, Refresh rate 90 Hz, Max brightness HBM - 550 cd/m², Scratch resistant, 2.5D curved glass glass, Capacitive, Multi-touch, Frameless

Chipset: Qualcomm Snapdragon 662; MediaTek Helio G91
CPU: 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz; 2x Cortex A75 2.0 GHz + 6x Cortex A55 1.8 GHz
Tipo di CPU: Octa-Core; Octa-Core
Processo: 11 nm; 12 nm
Frequenza: 2 GHz; 2 GHz
GPU: Qualcomm Adreno 610; Arm Mali-G52 MC2 850MHz
RAM: 8 GB; 6 GB
64 bit: Yes; Yes

Risoluzione: 13 Mpx; 108 Mpx
Apertura: Unknow; ƒ/ 1.8
Flash: LED; Quad LED
Stabilizzazione ottica: No; No
Slow motion: No, 30 fps; Yes, 120 fps
Caratteristiche: Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; 4K Video, Digital zoom, Dual camera, Digital image stabilization, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Capacità: 256 GB; 128 GB
Slot SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Tipo: —; eMMC 5.1 Storage

Dimensioni: 79.5 mm 159.0 mm 7.8 mm Print 3D Model; 76.3 mm 168.6 mm 8.3 mm Print 3D Model
Peso: 183 g; 205 g
Materiali: Plastic; Plastic , P2i Nano coating , Splash resistant design
Colori: Black; Black Cyan
Superficie utile: 76 %; 94 %

Sistema operativo: Android 12 Snow Cone Android 12; Android 14 Upside-down cake HyperOS (Android 14)
Servizi Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1; Bluetooth 5.3 LELow energy consumption
Profili Bluetooth: A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile), LE (Low Energy), APT-x
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Funzioni Wi-Fi: Dual band, Wi-Fi Hotspot; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Funzioni USB: Charging, OTG; Charging, OTG
Navigazione: GPS, A-GPS; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B3 (1800), B5 (850), B7 (2600), B8 (900), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)