hisense A9 Pro vs Oukitel WP23 Plus

In sintesi

Marca: HiSense; Oukitel
Data di uscita: marzo 2023, 3 anni e 3 mesi fa; marzo 2025, 1 anni e 3 mesi fa
AnTuTu: 102.000 Antutu v9 Overall performance better than 51% of devices; 251.400 Antutu v10 Overall performance better than 59% of devices

Dimensione: 6.1"; 6.52"
Risoluzione: 824 x 1648 px FHD; 720 x 1600 px HD+
Tipo: eInk E INK Carta 1200; LCD IPS
Densità: 302 ppi High Density; 269 ppi Medium Density
Rapporto d’aspetto: 18:9; 20:9
Caratteristiche: Water Drop Notch, Capacitive, Multi-touch, Frameless; Water Drop Notch, Brightnes 400 cd/m² (typ), 2.5D curved glass screen, Capacitive, Multi-touch

Chipset: Qualcomm Snapdragon 662; Unisoc Tiger T606
CPU: 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz; 2x1.6 GHz Cortex A75 + 6x1.6 GHz Cortex A55
Tipo di CPU: Octa-Core; Octa-Core
Processo: 11 nm; 12 nm
Frequenza: 2 GHz; 1.6 GHz
GPU: Qualcomm Adreno 610; ARM Mali-G57
RAM: 8 GB; 8 GB
64 bit: Yes; Yes
Tipo di RAM: —; LPDDR4X RAM

Risoluzione: 13 Mpx; 13 Mpx
Apertura: Unknow; Unknow
Flash: LED; LED
Stabilizzazione ottica: No; No
Slow motion: No, 30 fps; No, 30 fps
Caratteristiche: Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Triple camera, Digital image stabilization, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Sensore: —; Sony IMX135 Exmor RS
Dimensione pixel: —; 1.12 µm
Dimensione sensore: —; 1/3.06"

Capacità: 256 GB; 256 GB
Slot SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card

Dimensioni: 79.5 mm 159.0 mm 7.8 mm Print 3D Model; 84.0 mm 176.0 mm 17.0 mm Print 3D Model
Peso: 183 g; 360 g
Materiali: Plastic; Rugged Smartphone, Polycarbonate , Metal
Colori: Black; Black Green Orange
Superficie utile: 76 %; 80 %
Resistenza ad acqua/polvere: —; IP68, IP69 , MIL-STD-810H
Resistenza alle cadute: —; Class A B C D E 270 drops without defects
Riparabilità: —; Class A B C D E

Sistema operativo: Android 12 Snow Cone Android 12; Android 14 Upside-down cake Android 14
Servizi Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1; Bluetooth 5.0 LELow energy consumption
Profili Bluetooth: A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Funzioni Wi-Fi: Dual band, Wi-Fi Hotspot; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Funzioni USB: Charging, OTG; Charging, OTG
Navigazione: GPS, A-GPS; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B3 (1800), B7 (2600), B8 (900), B19 (800), B20 (800)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); CDMA BC0 (800), B2 (1900), B3 (1800), B5 (850), B8 (900)