hisense A9 Pro vs Oukitel WP100

In sintesi

Marca: HiSense; Oukitel
Data di uscita: marzo 2023, 3 anni e 3 mesi fa; febbraio 2025, 1 anni e 4 mesi fa
AnTuTu: 102.000 Antutu v9 Overall performance better than 51% of devices; 401.000 Antutu v10 Overall performance better than 65% of devices

Dimensione: 6.1"; 6.8"
Risoluzione: 824 x 1648 px FHD; 1080 x 2460 px FHD+
Tipo: eInk E INK Carta 1200; LCD IPS
Densità: 302 ppi High Density; 400 ppi Very high density
Rapporto d’aspetto: 18:9; 20:9
Caratteristiche: Water Drop Notch, Capacitive, Multi-touch, Frameless; Hole-punch Notch, Refresh rate 120 Hz, Brightnes 440 cd/m² (typ), 1200:1 contrast ratio, Corning Gorilla Glass 5, Capacitive, Multi-touch, In-cell

Chipset: Qualcomm Snapdragon 662; MediaTek Dimensity 7300
CPU: 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz; 4xCortex A78 2.5GHz + 4xCortex A55 2.0GHz
Tipo di CPU: Octa-Core; Octa-Core
Processo: 11 nm; 4 nm
Frequenza: 2 GHz; 2.5 GHz
GPU: Qualcomm Adreno 610; Arm Mali-G615 MC2
RAM: 8 GB; 16 GB
64 bit: Yes; Yes

Risoluzione: 13 Mpx; 200 Mpx
Apertura: Unknow; Unknow
Flash: LED; Dual LED
Stabilizzazione ottica: No; No
Slow motion: No, 30 fps; No, 30 fps
Caratteristiche: Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Triple camera, Digital image stabilization, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer, Night Vision

Capacità: 256 GB; 512 GB
Slot SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card

Dimensioni: 79.5 mm 159.0 mm 7.8 mm Print 3D Model; 84.1 mm 178.3 mm 34.0 mm Print 3D Model
Peso: 183 g; 550 g
Materiali: Plastic; Polycarbonate , Corning Gorilla Glass 5
Colori: Black; Black
Superficie utile: 76 %; 79 %
Resistenza ad acqua/polvere: —; IP68, IP69 , MIL-STD-810H
Resistenza alle cadute: —; Class A B C D E 270 drops without defects
Riparabilità: —; Class A B C D E

Sistema operativo: Android 12 Snow Cone Android 12; Android 14 Upside-down cake Android 14
Servizi Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1; Bluetooth 5.2 LELow energy consumption
Profili Bluetooth: A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Funzioni Wi-Fi: Dual band, Wi-Fi Hotspot; Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Funzioni USB: Charging, OTG; Charging, OTG
Navigazione: GPS, A-GPS; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100), B71 (600)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800), B34 (TD 2000), B39 (TD 1900+)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); CDMA BC0 (800), CDMA BC1 (1900), CDMA BC10 (800 Secondary), B2 (1900), B3 (1800), B5 (850), B8 (900)
5G: —; n1 (2100), n2 (1900 PCS), n3 (1800), n5 (850), n7 (2600), n8 (900), n20 (800), n25 (1900), n28b (700), n28a (700), n38 (2600), n41 (2500), n66 (1700), n71 (600), n77 (3700), n78 (3500), n79 (4700)