hisense A9 Pro vs hotwav Cyber X

In sintesi

Marca: HiSense; Hotwav
Data di uscita: marzo 2023, 3 anni e 2 mesi fa; luglio 2023, 2 anni e 10 mesi fa
AnTuTu: 102.000 Antutu v9 Overall performance better than 51% of devices; 415.300 Antutu v10 Overall performance better than 68% of devices

Dimensione: 6.1"; 6.78"
Risoluzione: 824 x 1648 px FHD; 1080 x 2460 px FHD+
Tipo: eInk E INK Carta 1200; LCD IPS
Densità: 302 ppi High Density; 396 ppi High Density
Rapporto d’aspetto: 18:9; 21:9
Caratteristiche: Water Drop Notch, Capacitive, Multi-touch, Frameless; Hole-punch Notch, Refresh rate 90 Hz, 1500:1 contrast ratio, Corning Gorilla Glass, Capacitive, Multi-touch

Chipset: Qualcomm Snapdragon 662; MediaTek Helio G99 (MT6789)
CPU: 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz; 2x Cortex A76 2.2 GHz + 6x Cortex A55 2.0 GHz
Tipo di CPU: Octa-Core; Octa-Core
Processo: 11 nm; 6 nm
Frequenza: 2 GHz; 2.2 GHz
GPU: Qualcomm Adreno 610; Mali-G57 MC2
RAM: 8 GB; 8 GB
64 bit: Yes; Yes
Tipo di RAM: —; LPDDR4X RAM

Risoluzione: 13 Mpx; 64 Mpx
Apertura: Unknow; Unknow
Flash: LED; Dual LED
Stabilizzazione ottica: No; No
Slow motion: No, 30 fps; No, 30 fps
Caratteristiche: Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Triple camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Sensore: —; Sony IMX686 Exmor RS
Dimensione pixel: —; 0.80 µm
Dimensione sensore: —; 1/1.7"

Capacità: 256 GB; 256 GB
Slot SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card

Dimensioni: 79.5 mm 159.0 mm 7.8 mm Print 3D Model; 85.1 mm 181.8 mm 17.5 mm Print 3D Model
Peso: 183 g; 380 g
Materiali: Plastic; TPU , Rugged Smartphone
Colori: Black; Black
Superficie utile: 76 %; 70 %
Resistenza ad acqua/polvere: —; IP68, MIL-STD-810G , IP69

Sistema operativo: Android 12 Snow Cone Android 12; Android 13 Tiramisu Android 13
Servizi Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1; Bluetooth 5.0
Profili Bluetooth: A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Funzioni Wi-Fi: Dual band, Wi-Fi Hotspot; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Funzioni USB: Charging, OTG; Charging, OTG
Navigazione: GPS, A-GPS; GPS, A-GPS, GLONASS, Beidou

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)