hisense A9 Pro vs hmd ARC

In sintesi

Marca: HiSense; HMD
Data di uscita: marzo 2023, 3 anni e 3 mesi fa; dicembre 2024, 1 anni e 6 mesi fa
AnTuTu: 102.000 Antutu v9 Overall performance better than 51% of devices; 154.110 Antutu v10 Overall performance better than 54% of devices

Dimensione: 6.1"; 6.52"
Risoluzione: 824 x 1648 px FHD; 576 x 1280 px LowRes
Tipo: eInk E INK Carta 1200; LCD IPS
Densità: 302 ppi High Density; 215 ppi Medium Density
Rapporto d’aspetto: 18:9; 20:9
Caratteristiche: Water Drop Notch, Capacitive, Multi-touch, Frameless; Water Drop Notch, Brightnes 400 cd/m² (typ), 70% NTSC, 2.5D curved glass screen, Capacitive, Multi-touch, Frameless

Chipset: Qualcomm Snapdragon 662; Spreadtrum Unisoc SC9863A
CPU: 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz; 4x Cortex A55 1.6 GHz + 4x Cortex A55 1.2 GHz
Tipo di CPU: Octa-Core; Octa-Core
Processo: 11 nm; 28 nm
Frequenza: 2 GHz; 1.6 GHz
GPU: Qualcomm Adreno 610; PowerVR GE8322
RAM: 8 GB; 4 GB
64 bit: Yes; Yes

Risoluzione: 13 Mpx; 13 Mpx
Apertura: Unknow; ƒ/ 2.0
Flash: LED; Dual LED
Stabilizzazione ottica: No; No
Slow motion: No, 30 fps; No, 30 fps
Caratteristiche: Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Dual camera, Digital image stabilization, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Dimensioni: 79.5 mm 159.0 mm 7.8 mm Print 3D Model; 76.9 mm 166.4 mm 9.0 mm Print 3D Model
Peso: 183 g; 185 g
Materiali: Plastic; Plastic
Colori: Black; Black
Superficie utile: 76 %; 80 %
Resistenza ad acqua/polvere: —; IP54
Resistenza alle cadute: —; Class A B C D E 270 drops without defects
Riparabilità: —; Class A B C D E

Sistema operativo: Android 12 Snow Cone Android 12; Android 14 Upside-down cake Android 14
Servizi Google: With Google Mobile Services; With Google Mobile Services
Aggiornamenti: —; OS updates: 5 years

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1; Bluetooth 5.2
Profili Bluetooth: A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11b , 802.11g , 802.11n
Funzioni Wi-Fi: Dual band, Wi-Fi Hotspot; Wi-Fi Hotspot
USB: USB Type-C; USB Type-C
Funzioni USB: Charging, OTG; Charging, OTG
Navigazione: GPS, A-GPS; GPS, A-GPS, Galileo

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B3 (1800), B5 (850), B7 (2600), B8 (900), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)