Cubot KingKong Power 3 vs hotwav W11

In sintesi

Marca: Cubot; Hotwav
Data di uscita: ottobre 2024, 1 anni e 7 mesi fa; marzo 2024, 2 anni e 2 mesi fa
AnTuTu: 411.163 Antutu v10 Overall performance better than 68% of devices; 260.000 Antutu v10 Overall performance better than 60% of devices

Dimensione: 6.72"; 6.6"
Risoluzione: 1080 x 2408 px FHD+; 1080 x 2460 px FHD+
Tipo: LCD IPS; LCD IPS
Densità: 401 ppi Very high density; 407 ppi Very high density
Rapporto d’aspetto: 20:9; 20:9
Caratteristiche: Water Drop Notch, Refresh rate 120 Hz, 2.5D curved glass screen, Capacitive, Multi-touch, In-cell; Hole-punch Notch, Brightnes 380 cd/m² (typ), 1000:1 contrast ratio, 1500:1 contrast ratio, Scratch resistant, Corning Gorilla Glass, Capacitive, Multi-touch

Chipset: MediaTek Helio G99 (MT6789); MediaTek MT8788V
CPU: 2x Cortex A76 2.2 GHz + 6x Cortex A55 2.0 GHz; 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz
Tipo di CPU: Octa-Core; Octa-Core
Processo: 6 nm; 12 nm
Frequenza: 2.2 GHz; 2 GHz
GPU: Mali-G57 MC2; Mali-G72 MP3
RAM: 6 GB; 6 GB
Tipo di RAM: LPDDR4X RAM; LPDDR4X RAM
64 bit: Yes; Yes

Risoluzione: 100 Mpx; 64 Mpx
Apertura: Unknow; ƒ/ 1.8
Dimensione pixel: 0.80 µm; 0.80 µm
Flash: LED; Dual LED
Stabilizzazione ottica: No; No
Slow motion: No, 30 fps; No, 30 fps
Caratteristiche: Triple camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Scene mode, Self-timer; Digital zoom, Dual camera, Autofocus, Touch focus, Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Sensore: —; Sony IMX686 Exmor RS
Dimensione sensore: —; 1/1.7"

Capacità: 256 GB; 256 GB
Slot SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Tipo: —; UFS Storage 2.1

Dimensioni: 82.7 mm 165.3 mm 20.0 mm Print 3D Model; 84.8 mm 176.6 mm 26.5 mm Print 3D Model
Peso: 425 g; 563 g
Materiali: Rugged Smartphone, Metal; Rugged Smartphone, Polycarbonate
Colori: Black; Gray Orange
Resistenza ad acqua/polvere: IP68, IP69; IP68, MIL-STD-810G , IP69
Resistenza alle cadute: Class A B C D E 270 drops without defects; —
Riparabilità: Class A B C D E; —
Superficie utile: 79 %; 70 %

Sistema operativo: Android 14 Upside-down cake Android 14; Android 13 Tiramisu Android 13
Servizi Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.2; Bluetooth 4.2 LELow energy consumption
Profili Bluetooth: A2DP (Advanced Audio Distribution Profile); A2DP (Advanced Audio Distribution Profile), LE (Low Energy), LDAC, SBC, AAC
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Funzioni Wi-Fi: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Funzioni USB: Charging, OTG; Charging, OTG
Navigazione: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B26 (850), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800); B1 (2100), B2 (1900), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); CDMA BC0 (800), CDMA BC1 (1900), CDMA BC10 (800 Secondary), B2 (1900), B3 (1800), B5 (850), B8 (900)