Cubot KingKong Power 3 vs hotwav T7

In sintesi

Marca: Cubot; Hotwav
Data di uscita: ottobre 2024, 1 anni e 7 mesi fa; luglio 2024, 1 anni e 10 mesi fa
AnTuTu: 411.163 Antutu v10 Overall performance better than 68% of devices; 241.300 Antutu v10 Overall performance better than 58% of devices

Dimensione: 6.72"; 6.6"
Risoluzione: 1080 x 2408 px FHD+; 1080 x 2460 px FHD+
Tipo: LCD IPS; LCD IPS
Densità: 401 ppi Very high density; 407 ppi Very high density
Rapporto d’aspetto: 20:9; 21:9
Caratteristiche: Water Drop Notch, Refresh rate 120 Hz, 2.5D curved glass screen, Capacitive, Multi-touch, In-cell; Without Notch, Brightnes 480 cd/m² (typ), Scratch resistant, Corning Gorilla Glass 3, Capacitive, Multi-touch

Chipset: MediaTek Helio G99 (MT6789); MediaTek MT8788V
CPU: 2x Cortex A76 2.2 GHz + 6x Cortex A55 2.0 GHz; 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz
Tipo di CPU: Octa-Core; Octa-Core
Processo: 6 nm; 12 nm
Frequenza: 2.2 GHz; 2 GHz
GPU: Mali-G57 MC2; Mali-G72 MP3
RAM: 6 GB; 4 GB
Tipo di RAM: LPDDR4X RAM; LPDDR4X RAM
64 bit: Yes; Yes

Risoluzione: 100 Mpx; 21 Mpx
Apertura: Unknow; Unknow
Dimensione pixel: 0.80 µm; —
Flash: LED; LED
Stabilizzazione ottica: No; No
Slow motion: No, 30 fps; No, 30 fps
Caratteristiche: Triple camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Scene mode, Self-timer; Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Sensore: —; Sony Exmor

Capacità: 256 GB; 128 GB
Slot SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Tipo: —; eMMC 5.1 Storage

Dimensioni: 82.7 mm 165.3 mm 20.0 mm Print 3D Model; 82.8 mm 174.6 mm 12.8 mm Print 3D Model
Peso: 425 g; 292 g
Materiali: Rugged Smartphone, Metal; Rugged Smartphone, Plastic , Faux leather
Colori: Black; Black Orange
Resistenza ad acqua/polvere: IP68, IP69; IP68, IP69 , MIL-STD-810H
Resistenza alle cadute: Class A B C D E 270 drops without defects; —
Riparabilità: Class A B C D E; —
Superficie utile: 79 %; 71 %

Sistema operativo: Android 14 Upside-down cake Android 14; Android 13 Tiramisu Android 13
Servizi Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.2; Bluetooth 5.0 LELow energy consumption
Profili Bluetooth: A2DP (Advanced Audio Distribution Profile); A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Funzioni Wi-Fi: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Funzioni USB: Charging, OTG; Charging, OTG
Navigazione: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B26 (850), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)