Cubot KingKong Power 3 vs hotwav Cyber 15

In sintesi

Marca: Cubot; Hotwav
Data di uscita: ottobre 2024, 1 anni e 7 mesi fa; maggio 2024, 2 anni fa
AnTuTu: 411.163 Antutu v10 Overall performance better than 68% of devices; 415.300 Antutu v10 Overall performance better than 68% of devices

Dimensione: 6.72"; 6.6"
Risoluzione: 1080 x 2408 px FHD+; 1080 x 2408 px FHD+
Tipo: LCD IPS; LCD IPS
Densità: 401 ppi Very high density; 396 ppi High Density
Rapporto d’aspetto: 20:9; 21:9
Caratteristiche: Water Drop Notch, Refresh rate 120 Hz, 2.5D curved glass screen, Capacitive, Multi-touch, In-cell; Hole-punch Notch, Refresh rate 90 Hz, 1500:1 contrast ratio, Corning Gorilla Glass, Capacitive, Multi-touch

Chipset: MediaTek Helio G99 (MT6789); MediaTek Helio G99 (MT6789)
CPU: 2x Cortex A76 2.2 GHz + 6x Cortex A55 2.0 GHz; 2x Cortex A76 2.2 GHz + 6x Cortex A55 2.0 GHz
Tipo di CPU: Octa-Core; Octa-Core
Processo: 6 nm; 6 nm
Frequenza: 2.2 GHz; 2.2 GHz
GPU: Mali-G57 MC2; Mali-G57 MC2
RAM: 6 GB; 12 GB
Tipo di RAM: LPDDR4X RAM; LPDDR4X RAM
64 bit: Yes; Yes

Risoluzione: 100 Mpx; 200 Mpx
Apertura: Unknow; ƒ/ 1.8
Dimensione pixel: 0.80 µm; —
Flash: LED; Dual LED
Stabilizzazione ottica: No; No
Slow motion: No, 30 fps; No, 30 fps
Caratteristiche: Triple camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Scene mode, Self-timer; Digital zoom, Dual camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Sensore: —; Samsung S5KHP3SP
Dimensione sensore: —; 1/1.4"

Capacità: 256 GB; 256 GB
Slot SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card

Dimensioni: 82.7 mm 165.3 mm 20.0 mm Print 3D Model; 82.3 mm 174.6 mm 12.8 mm Print 3D Model
Peso: 425 g; 290 g
Materiali: Rugged Smartphone, Metal; TPU , Rugged Smartphone
Colori: Black; Black
Resistenza ad acqua/polvere: IP68, IP69; IP68, MIL-STD-810G , IP69
Resistenza alle cadute: Class A B C D E 270 drops without defects; Class A B C D E 270 drops without defects
Riparabilità: Class A B C D E; Class A B C D E
Superficie utile: 79 %; 67 %

Sistema operativo: Android 14 Upside-down cake Android 14; Android 13 Tiramisu Android 13
Servizi Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.2; Bluetooth 5.1
Profili Bluetooth: A2DP (Advanced Audio Distribution Profile); A2DP (Advanced Audio Distribution Profile)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Funzioni Wi-Fi: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Funzioni USB: Charging, OTG; Charging, OTG
Navigazione: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B26 (850), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B30 (2300), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100), B71 (600)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)