Cubot KingKong 8 vs hisense A9 Pro

In sintesi

Marca: Cubot; HiSense
Data di uscita: ottobre 2023, 2 anni e 7 mesi fa; marzo 2023, 3 anni e 2 mesi fa
AnTuTu: 224.235 Antutu v9 Overall performance better than 56% of devices; 102.000 Antutu v9 Overall performance better than 51% of devices

Dimensione: 6.53"; 6.1"
Risoluzione: 720 x 1612 px HD+; 824 x 1648 px FHD
Tipo: LCD IPS; eInk E INK Carta 1200
Densità: 401 ppi Very high density; 302 ppi High Density
Rapporto d’aspetto: 20:9; 18:9
Caratteristiche: Hole-punch Notch, 2.5D curved glass screen, Capacitive, Multi-touch, In-cell; Water Drop Notch, Capacitive, Multi-touch, Frameless

Chipset: MediaTek MT8788V; Qualcomm Snapdragon 662
CPU: 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz; 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz
Tipo di CPU: Octa-Core; Octa-Core
Processo: 12 nm; 11 nm
Frequenza: 2 GHz; 2 GHz
GPU: Mali-G72 MP3; Qualcomm Adreno 610
RAM: 6 GB; 8 GB
Tipo di RAM: LPDDR4X RAM; —
64 bit: Yes; Yes

Risoluzione: 48 Mpx; 13 Mpx
Apertura: Unknow; Unknow
Dimensione pixel: 0.80 µm; —
Flash: Triple LED; LED
Stabilizzazione ottica: No; No
Slow motion: No, 30 fps; No, 30 fps
Caratteristiche: Triple camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Scene mode, Self-timer; Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Capacità: 256 GB; 256 GB
Slot SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card

Dimensioni: 80.2 mm 169.9 mm 20.0 mm Print 3D Model; 79.5 mm 159.0 mm 7.8 mm Print 3D Model
Peso: 382 g; 183 g
Materiali: Rugged Smartphone, Metal; Plastic
Colori: Black Red Green; Black
Resistenza ad acqua/polvere: IP68, IP69; —
Resistenza alle cadute: Class A B C D E 270 drops without defects; —
Riparabilità: Class A B C D E; —
Superficie utile: 76 %; 76 %

Sistema operativo: Android 13 Tiramisu Android 13; Android 12 Snow Cone Android 12
Servizi Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 4.2; Bluetooth 5.1
Profili Bluetooth: A2DP (Advanced Audio Distribution Profile); A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Funzioni Wi-Fi: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot
USB: USB Type-C; USB Type-C
Funzioni USB: Charging, OTG; Charging, OTG
Navigazione: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B26 (850), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)